Millimeter wave carbon nanotube based flip chip coplanar interconnects

Joseph de Saxce (1) , Philippe Roux-Levy (1) , Chun Fei Siah (2) , Jianxiong Wang (2) , Beng Kang Tay (2) , Philippe Coquet (3) , Dominique Baillargeat (1)

1 XLIM-SRF - Systèmes RF
2 CINTRA / SEEE Nanyang Technological University
3 IEMN - Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520

In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts supporting a coplanar waveguide (CPW) mode. Starting from the promising results of a previously measured device [1] we suggest a way to improve the behavior of VACNT arrays interconnects. We perform full-wave modeling of a new structure that will be fabricated and tested and we compare different modelling approaches for the design of such interconnects.

Domaines: Electromagnétisme; Electronique; Sciences de l'ingénieur [physics]

Joseph de Saxce, Philippe Roux-Levy, Chun Fei Siah, Jianxiong Wang, Beng Kang Tay, et al.. Millimeter wave carbon nanotube based flip chip coplanar interconnects. 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Dec 2020, Singapore, Singapore. pp.81-84, ⟨10.1109/EPTC50525.2020.9314999⟩. ⟨hal-03140965⟩