Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

E. Ben Romdhane (1, 2) , A. Guédon-Gracia (1) , S. Pin (2) , P. Roumanille (2) , H. Frémont (1)

1 IMS - Laboratoire de l'intégration, du matériau au système
2 IRT Saint Exupéry - Institut de Recherche Technologique

Domains: Engineering Sciences [physics]; Micro and nanotechnologies/Microelectronics

E. Ben Romdhane, A. Guédon-Gracia, S. Pin, P. Roumanille, H. Frémont. Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components. Microelectronics Reliability, 2020, pp.113812. ⟨10.1016/j.microrel.2020.113812⟩. ⟨hal-03011618⟩