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An inverse approach for ultrasonic imaging from full matrix capture data. Application to resolution enhancement in NDT.

Abstract : In the context of nondestructive testing (NDT), this paper proposes an inverse problem approach for the reconstruction of high-resolution ultrasonic images from full matrix capture (FMC) datasets. We build a linear model that links the FMC data, i.e. the signals collected from all transmitter-receiver pairs of an ultrasonic array, to the discretized reflectivity map of the inspected object. In particular, this model includes the ultrasonic waveform corresponding to the transducers response. Despite the large amount of data, the inversion problem is illposed. Therefore, a regularization strategy is proposed, where the reconstructed image is defined as the minimizer of a penalized least-squares cost function. A mixed penalization function is considered, which simultaneously enhances the sparsity of the image (in NDT, the reflectivity map is mostly zero except at the flaw locations) and its spatial smoothness (flaws may have some spatial extension). The proposed method is shown to outperform two well-known imaging methods: the Total Focusing Method (TFM) and Excitelet. Numerical simulations with two close reflectors show that the proposed method improves the resolution limit defined by the Rayleigh criterion by a factor of four. Such high-resolution imaging capability is confirmed by experimental results obtained with side drilled holes in an aluminum plate.
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https://hal.archives-ouvertes.fr/hal-02564265
Contributor : Jérôme Idier <>
Submitted on : Monday, November 23, 2020 - 3:23:14 PM
Last modification on : Friday, January 22, 2021 - 3:03:23 PM
Long-term archiving on: : Thursday, February 25, 2021 - 1:34:32 PM

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Nans Laroche, Sébastien Bourguignon, Ewen Carcreff, Jérôme Idier, Aroune Duclos. An inverse approach for ultrasonic imaging from full matrix capture data. Application to resolution enhancement in NDT.. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, Institute of Electrical and Electronics Engineers, 2020, 67 (9), pp.1877-1887. ⟨10.1109/TUFFC.2020.2990430⟩. ⟨hal-02564265⟩

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