Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die
Résumé
A flow line function is proposed to describe the material deformation in ECAE for a 120° die. This new analytical approach is incorporated into a viscoplastic self-consistent polycrystal code to simulate the texture evolution in Route A of copper and compared to experimental textures as well as to those corresponding to simple shear.
Origine : Fichiers produits par l'(les) auteur(s)
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