Cryoetching of silicon for MEMS and microelectronic components

Remi Dussart (1) , Philippe Lefaucheux (1) , Pierre Ranson (1) , Laurianne E. Pichon (1) , Corinne Y. Duluard (1) , El-Houcine Oubensaid (1) , Thomas Tillocher (1) , Xavier Mellhaoui (1) , Nasreddine Mekkakia Maaza (1) , Mohamed Boufnichel (2) , Lawrence J. Overzet (3)

1 GREMI - Groupe de recherches sur l'énergétique des milieux ionisés
2 ST-CROLLES - STMicroelectronics [Crolles]
3 PAL - Plasma Application Laboratory

Domains: Plasma Physics [physics.plasm-ph]

Remi Dussart, Philippe Lefaucheux, Pierre Ranson, Laurianne E. Pichon, Corinne Y. Duluard, et al.. Cryoetching of silicon for MEMS and microelectronic components. 16th International Colloquium on Plasma Processes, Jun 2007, France. ⟨hal-00442662⟩