Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging - Archive ouverte HAL Access content directly
Conference Papers Year : 2008

Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging

Charles Regard
  • Function : Author
Laboratoire de l'intégration, du matériau au système
Christian Gautier
  • Function : Author
Hélène Fremont
Laboratoire de l'intégration, du matériau au système
Patrick Poirier
  • Function : Author

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Micro and nanotechnologies/Microelectronics

Hélène Fremont  : Connect in order to contact the contributor

https://hal.science/hal-00323432

Submitted on : Monday, September 22, 2008-10:53:03 AM

Last modification on : Monday, June 5, 2023-4:52:11 PM

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hal-00323432 , version 1 (22-09-2008)

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  • HAL Id : hal-00323432 , version 1

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Charles Regard, Christian Gautier, Hélène Fremont, Patrick Poirier. Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Jul 2008, China. pp.ICEPT 2008. ⟨hal-00323432⟩

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