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Article Dans Une Revue Microelectronics Reliability Année : 2022

A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices

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hal-03656143 , version 1 (01-05-2022)

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Mustafa Shqair, Zoubir Khatir, Ali Ibrahim, Mounira Bouarroudj-Berkani, Ayda Halouani, et al.. A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices. Microelectronics Reliability, 2022, 132, pp.114516. ⟨10.1016/j.microrel.2022.114516⟩. ⟨hal-03656143⟩
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