Modular Multi-level Converter Hardware-in-the-Loop Simulation on low-cost System-on-Chip devices

Daniel Tormo (1, 2) , R. Vidal-Albalate (3) , Lahoucine Idkhajine (1) , Eric Monmasson (1, 2) , R. Blasco-Gimenez (4)

1 CY - CY Cergy Paris Université
2 SATIE - Systèmes et Applications des Technologies de l'Information et de l'Energie
3 Universitat Jaume I = Jaume I University
4 UPV - Universitat Politècnica de València = Universitad Politecnica de Valencia = Polytechnic University of Valencia

Domaines: Sciences de l'ingénieur [physics]

Daniel Tormo, R. Vidal-Albalate, Lahoucine Idkhajine, Eric Monmasson, R. Blasco-Gimenez. Modular Multi-level Converter Hardware-in-the-Loop Simulation on low-cost System-on-Chip devices. IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society, Oct 2018, Washington, United States. pp.2827-2832, ⟨10.1109/IECON.2018.8591256⟩. ⟨hal-03271454⟩