Analytical multi-step homogenization methodology for a stack of thin films in microelectronics

H. Miled (1) , F. Roqueta (2) , J. Craveur , E. Le Bourhis (3) , P. Gardes , Abdellah Tougui (1)

1 MMP - Mécanique des Matériaux et Procédés
2 ST-TOURS - STMicroelectronics [Tours]
3 PPrime [Poitiers] - Institut Pprime [UPR 3346]

Domaines: Matériaux et structures en mécanique [physics.class-ph]; Mécanique des matériaux [physics.class-ph]; Mécanique des solides [physics.class-ph]; Mécanique des structures [physics.class-ph]

H. Miled, F. Roqueta, J. Craveur, E. Le Bourhis, P. Gardes, et al.. Analytical multi-step homogenization methodology for a stack of thin films in microelectronics. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, Poland. pp.1-7, ⟨10.1109/EuroSimE48426.2020.9152652⟩. ⟨hal-02972476⟩