Removing epoxy underfill between neighbouring components using acid for component chip-off

Thibaut Heckmann , Th Heckmann (1, 2, 3) , J.P. Mcevoy (3) , K. Markantonakis (3) , R.N. Akram (3) , D. Naccache (2)

1 IRCGN - Institut de Recherche Criminelle de la Gendarmerie Nationale (Ministère de l'intérieur)
2 DI-ENS - Département d'informatique - ENS Paris
3 RHUL - Royal Holloway [University of London]

Domaines: Informatique [cs]; Cryptographie et sécurité [cs.CR]

Thibaut Heckmann, Th Heckmann, J.P. Mcevoy, K. Markantonakis, R.N. Akram, et al.. Removing epoxy underfill between neighbouring components using acid for component chip-off. Digital Investigation, 2019, 29, pp.198-209. ⟨10.1016/j.diin.2019.04.003⟩. ⟨hal-02913019⟩