A solvent-free and vacuum-free melt-processing method to fabricate organic semiconducting layers with large crystal size for organic electronic applications

Jean-Charles Ribierre (1) , Zhao Li , Xiao Liu (2, 3) , Emmanuelle Lacaze (3) , Benoît Heinrich (4) , Stéphane Méry (4) , Piotr Sleczkowski (3) , Yiming Xiao (5) , Frédéric Lafolet (6) , Daisuke Hashizume (7) , Tetsuya Aoyama (7) , Masanobu Uchiyama (7) , Jeong Weon Wu (8) , Elena Zaborova (9) , Frédéric Fages (9) , Anthony D’aléo (9) , Fabrice Mathevet (10, 1) , Chihaya Adachi (2)

1 Center for Organic Photonics and Electronics Research
2 IPCM - Institut Parisien de Chimie Moléculaire
3 INSP-E6 - Physico-chimie et dynamique des surfaces
4 IPCMS - Institut de Physique et Chimie des Matériaux de Strasbourg
5 Department of Physics, Ewha Womans University, Seoul
6 DCM - CIRE - Département de Chimie Moléculaire - Chimie Inorganique Redox
7 RIKEN - RIKEN - Institute of Physical and Chemical Research [Japon]
8 CNRS-Ewha International Research Center
9 CINaM - Centre Interdisciplinaire de Nanoscience de Marseille
10 IPCM - Institut Parisien de Chimie Moléculaire

Domaines: Matériaux

Jean-Charles Ribierre, Zhao Li, Xiao Liu, Emmanuelle Lacaze, Benoît Heinrich, et al.. A solvent-free and vacuum-free melt-processing method to fabricate organic semiconducting layers with large crystal size for organic electronic applications. Journal of Materials Chemistry C, 2019, 7 (11), pp.3190-3198. ⟨10.1039/c8tc04834g⟩. ⟨hal-02367959⟩