Hybrid 3D integrated circuit at millimeter-wave frequencies: advantages and trends

Christian Person (1) , Eric Rius (2) , Jean-Philippe Coupez (1)

1 MO - Département Micro-Ondes
2 LEST - Laboratoire d'Electronique et Systèmes de Télécommunications

The implementation of passive rf functions is usually done by means of coplanar waveguides at mm-wave frequencies. We propose original solutions for improving their reliability, by integrating the parasitic mode filters as dielectric bridges through a 3D integration approach. Furthermore, original compensating methods are proposed in order to control the cut-off frequencies induced by the bounding networks. The 3D hybrid approach can also be efficiently used so as to accommodate the association between active, passive and radiating components. The 3D-CPW technology is therefore completed with Thin Film MicroStrip configurations (tfms), while composite ceramic/foam architectures become thinkable for radiating arrays.

Mots clés: Patch antenna; Antenna array; Microstrip line; Coplanar technology; Millimetric wave; Three-dimensional integration; Microwave integrated circuit; Dielectric substrate; Hybrid integrated circuit; Multilayered structure

Domaines: Electronique

Christian Person, Eric Rius, Jean-Philippe Coupez. Hybrid 3D integrated circuit at millimeter-wave frequencies: advantages and trends. Annales des Télécommunications, 2001, 56 (1-2), pp.39-50. ⟨10.1007/BF03002984⟩. ⟨hal-02355441⟩