Analysis and comparison of different methods used to extract isoclinic and isochromatic parameters. Application to the determination of the residual stresses inside crystal silicon wafers - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Strain Année : 2018

Analysis and comparison of different methods used to extract isoclinic and isochromatic parameters. Application to the determination of the residual stresses inside crystal silicon wafers

Résumé

The present work focuses on an experimental analysis of different photoelastic extraction methods. An adapted test rig designed in order to evaluate several extraction methods, which come from the literature and 2 new proposed methods. Their comparisons point out dissimilar behaviours between them in an experimental environment. However, some specific cases require the use of most appropriate techniques to minimise the defects influence. Therefore, a specific application of the photoelasticity is presented to illustrate the meaning of the technique used. It mainly focuses on the determination of the residual stresses and their orientation inside photovoltaic crystal silicon wafers.
Fichier non déposé

Dates et versions

hal-02308421 , version 1 (08-10-2019)

Identifiants

Citer

F. Jagailloux, Valery Valle. Analysis and comparison of different methods used to extract isoclinic and isochromatic parameters. Application to the determination of the residual stresses inside crystal silicon wafers. Strain, 2018, 54 (4), pp.e12275. ⟨10.1111/str.12275⟩. ⟨hal-02308421⟩
9 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More