Evaluation of the PCB-embedding technology for a 3.3 kW converter

Rémy Caillaud (1) , Johan Le Lesle (1) , Cyril Buttay (2) , Florent Morel (2) , Roberto Mrad (1) , Nicolas Degrenne (1) , Stefan Mollov (1)

1 MERCE-France - Mitsubishi Electric R&D Centre Europe [France]
2 EE - Ampère, Département Energie Electrique

This paper presents a converter fully made using PCB embedding technology (including the semiconductor devices , but also their gate driver circuits as well as the passive components). This converter is rated at a high-power (3.3 kW) considering the PCB technology. Here, the focus is given to the experimental validation of the embedding process, with the characterization of many of the embedded devices (SiC MOS-FETs, diodes, capacitors). These results show that most of the components were unaffected by the process, with the noticeable exception of the large inductors which exhibit variations in the inductance values as well as a large ac resistance. Finally, the converter is successfully assembled an tested at low power.

Domaines: Energie électrique

Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Evaluation of the PCB-embedding technology for a 3.3 kW converter. IEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩. ⟨hal-02291502⟩