Thermal conduction in novel isotropic conductive adhesive

Helge Kristiansen (1) , Keith Redford (1) , Susanne Helland (2) , Erik Kalland (3) , Nina Hoglund (1) , Mohammad Abo Ras (4) , Corinna Grosse (4) , Bruno Hay (5) , Liana Ramiandrisoa (5) , Guillaume Davee (5) , Séverine Gomès (6) , Sigurd Pettersen (1)

1 Conpart AS
2 Mosaic Solutions AS
3 Mosaic Solutions AS
4 Berliner Nanotest und Design GmbH
5 LNE - Laboratoire National de Métrologie et d'Essais [Trappes]
6 CETHIL - Centre d'Energétique et de Thermique de Lyon

Domaines: Sciences de l'ingénieur [physics]

Helge Kristiansen, Keith Redford, Susanne Helland, Erik Kalland, Nina Hoglund, et al.. Thermal conduction in novel isotropic conductive adhesive. 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2017, Amsterdam, Netherlands. pp.1-5. ⟨hal-02023979⟩