Coupling thermal and kinematic full field measurement for the mechanical characterization of metals at high temperature

Rébecca Bonnaire (1) , Benjamin Verdeil (1) , Rémi Gilblas (1) , Yannick Le Maoult (1) , Thierry Sentenac (1)

1 ICA - Institut Clément Ader

Mechanical tests were developed to characterize metallic materials at high temperature. Specimens used in these tests can have 3D complex geometry. During the tests, measuring both thermal and kinematic fields is important. Thermal measurement is well control for plane shape samples with a relatively homogenous surface state, but not when the part is convex or concave. Kinematic measurement is well controlled at room temperature but not at high temperature. The aim of this study is to develop a device to measure both temperature and shape during mechanical testing with a 3D complex geometry sample at high temperature.

Mots clés: infrared thermography; high temperature; DIC; complex geometries

Domaines: Mécanique des fluides [physics.class-ph]; Mécanique [physics.med-ph]; Thermique [physics.class-ph]; Optique / photonique; Traitement du signal et de l'image [eess.SP]

Rébecca Bonnaire, Benjamin Verdeil, Rémi Gilblas, Yannick Le Maoult, Thierry Sentenac. Coupling thermal and kinematic full field measurement for the mechanical characterization of metals at high temperature. Photomechanics, Mar 2018, Toulouse, France. ⟨hal-01901710⟩