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Coupling thermal and kinematic full field measurement for the mechanical characterization of metals at high temperature

Abstract : Mechanical tests were developed to characterize metallic materials at high temperature. Specimens used in these tests can have 3D complex geometry. During the tests, measuring both thermal and kinematic fields is important. Thermal measurement is well control for plane shape samples with a relatively homogenous surface state, but not when the part is convex or concave. Kinematic measurement is well controlled at room temperature but not at high temperature. The aim of this study is to develop a device to measure both temperature and shape during mechanical testing with a 3D complex geometry sample at high temperature.
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https://hal.archives-ouvertes.fr/hal-01901710
Contributor : Rébecca Bonnaire <>
Submitted on : Tuesday, October 23, 2018 - 10:49:58 AM
Last modification on : Wednesday, June 24, 2020 - 4:18:55 PM
Long-term archiving on: : Thursday, January 24, 2019 - 1:11:13 PM

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  • HAL Id : hal-01901710, version 1

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Rébecca Bonnaire, Benjamin Verdeil, Rémi Gilblas, Yannick Le Maoult, Thierry Sentenac. Coupling thermal and kinematic full field measurement for the mechanical characterization of metals at high temperature. Photomechanics, Mar 2018, Toulouse, France. ⟨hal-01901710⟩

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