Micro heat pipe design and fabrication on LTCC

Malika Tlili 1 Maïna Sinou 1, 2 Camilla Kärnfelt 3, 1 Daniel Bourreau 4, 1 Alain Peden 3, 1
3 Lab-STICC_IMTA_MOM_DIM
Lab-STICC - Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance
4 Lab-STICC_IMTA_MOM_PIM
Lab-STICC - Laboratoire des sciences et techniques de l'information, de la communication et de la connaissance
Abstract : This paper presents work on micro heat pipe (MHP) fabrication in Low Temperature Cofired Ceramics (LTCC) modules for cooling purpose. The MHPs are fabricated in a 10 layer structure using ESL41020 tape. Different fabrication settings have been tested to minimize swelling and groove deformation. The best result is obtained by using fugitive tape, extended firing profile, and hot lamination at 50°C for 5 minutes with 70 bar pressure.
Type de document :
Communication dans un congrès
ESTC2018: Electronics System-Integration Technology Conference, Sep 2018, Dresde, Germany. Proceedings ESTC2018: Electronics System-Integration Technology Conference, 2018
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https://hal.archives-ouvertes.fr/hal-01881235
Contributeur : Bibliothèque Télécom Bretagne <>
Soumis le : mardi 25 septembre 2018 - 15:39:32
Dernière modification le : mercredi 28 novembre 2018 - 01:22:13

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  • HAL Id : hal-01881235, version 1

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Malika Tlili, Maïna Sinou, Camilla Kärnfelt, Daniel Bourreau, Alain Peden. Micro heat pipe design and fabrication on LTCC. ESTC2018: Electronics System-Integration Technology Conference, Sep 2018, Dresde, Germany. Proceedings ESTC2018: Electronics System-Integration Technology Conference, 2018. 〈hal-01881235〉

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