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Article Dans Une Revue IEEE Transactions on Advanced Packaging Année : 2008

RF Low-Pass Design Guiding Rules to Improve PCB to Die Transition Applied to Different Types of Low-Cost Packages

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Electronique
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hal-01856772 , version 1 (13-08-2018)

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J. Cubillo, Jean Gaubert, Sylvain Bourdel, Herve Barthelemy. RF Low-Pass Design Guiding Rules to Improve PCB to Die Transition Applied to Different Types of Low-Cost Packages. IEEE Transactions on Advanced Packaging, 2008, 31 (3), pp.527 - 535. ⟨10.1109/TADVP.2008.924229⟩. ⟨hal-01856772⟩
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