Mechanical behavior and damage of ceramics-tungsten electronic power substrates tridimensional multilayers

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Conference papers
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https://hal.archives-ouvertes.fr/hal-01700483
Contributor : Stéphane Lefebvre <>
Submitted on : Sunday, February 4, 2018 - 4:58:25 PM
Last modification on : Thursday, May 16, 2019 - 1:32:50 AM

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  • HAL Id : hal-01700483, version 1

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Charlotte Robert, Sylvie Pommier, Stéphane Lefebvre, Marion Ortali, Michel Massiot. Mechanical behavior and damage of ceramics-tungsten electronic power substrates tridimensional multilayers. 12th International Conference on Engineering Structural Integrity Assessment (ESIA12), 2013, Manchester, United Kingdom. ⟨hal-01700483⟩

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