Laser probes for the thermal and thermomechanical characterisation of microelectronic devices
Résumé
This paper presents a review of some of the recent works that we have done on thermal characterisation of running electronic devices by laser probing. Both the single point probing and the surface imaging methodologies are considered. Besides temperature mapping, laser point probing allows fault detection in integrated circuits. Electronic speckle pattern interferometry and shearography metholologies are presented, and examples of images of running power devices and this relation to the underlying thermomechanical stress are shown.