TESTING OF THE QUALITY OF SOLDER JOINTS THROUGH THE ANALYSIS OF THEIR THERMAL-BEHAVIOR WITH AN INTERFEROMETRIC LASER PROBE

W. Claeys (1) , V. Quintard (1) , S. Dilhaire (1) , D. Lewis (1) , Y. Danto (2)

1 CPMOH - Centre de physique moléculaire optique et hertzienne
2 IXL - Laboratoire d'études de l'intégration des composants et systèmes électroniques

no abstract

Domaines: Physique [physics]

W. Claeys, V. Quintard, S. Dilhaire, D. Lewis, Y. Danto. TESTING OF THE QUALITY OF SOLDER JOINTS THROUGH THE ANALYSIS OF THEIR THERMAL-BEHAVIOR WITH AN INTERFEROMETRIC LASER PROBE. Quality and Reliability Engineering International, 1994, 10 (3), pp.237-242. ⟨hal-01549896⟩