Analyse fiabiliste du comportement visco-plastique des brasures de modules IGBT

Abstract : The major failure mode of power IGBT is the thermal fatigue of the solder joints. The thermal heating induces mechanical constraints due to the various coefficients of thermal expansion of different materials. The life in fatigue, bound to the non-elastic energy dissipated during acycle, depends strongly onthegeometrical shape ofsolder, onthenon-linear behaviour and on the applied load. The reliability methods are then applied here with response surface method and neural networks.
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Alexandre Micol, Carmen Martin, Olivier Dalverny, Michel Mermet-Guyennet, Moussa Karama. Analyse fiabiliste du comportement visco-plastique des brasures de modules IGBT. 8e Colloque national en calcul des structures, CSMA, May 2007, Giens, France. ⟨hal-01508942⟩

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