The channeling effect of Al and N ion implantation in 4H–SiC during JFET integrated device processing - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms Année : 2015

The channeling effect of Al and N ion implantation in 4H–SiC during JFET integrated device processing

Résumé

A strong channeling effect is observed for the ions of Al and N implanted in 4H–SiC due to its crystalline structure. This effect causes difficulties in subsequent accurate estimation of the depth of junctions formed by multiple ion implantation steps. A variety of lateral JFET transistors integrated on the same 4H–SiC wafer have been fabricated. Secondary Ion Mass Spectrometry measurements and Monte-Carlo simulations were performed in order to quantify and control the channeling effect of the implanted ions. A technological process was established enabling to obtain devices working with the presence of the channeling effect.
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Dates et versions

hal-01391844 , version 1 (09-05-2019)

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Mihai Lazar, Farah Laariedh, Pierre Cremillieu, Dominique Planson, Jean-Louis Leclercq. The channeling effect of Al and N ion implantation in 4H–SiC during JFET integrated device processing. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 2015, 365, pp.256 - 259. ⟨10.1016/j.nimb.2015.07.033⟩. ⟨hal-01391844⟩
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