Achievements and advances at CMP

B. Courtois (1) , K. Torki (1) , B. Charlot (1) , H. Delori (1) , S. Eyraud (1) , J.-F. Paillotin (1)

1 TIMA - Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés

CMP aims at providing Universities, Research Laboratories and Industries with the facility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are provided with a number of processes : CMOS down to 1.8µ, BiCMOS, SiGE HBT, GaAS HEMT and SOI/SOS. Micro Electro Mechanical Systems (MEMS) are provided in standard CMP runs in CMOS, BiCMOS and HEMT GaAS, using compatible front-side bulk micro-machining. MUMPS process is offered as a surface micro-machining, MCM processes, CAD software and design kits are also provided. This paper reviews the portfolio, addresses 2 main areas of development, namely deep submicron processes and MEMS, and discusses cooperation schemes.

Domaines: Micro et nanotechnologies/Microélectronique

B. Courtois, K. Torki, B. Charlot, H. Delori, S. Eyraud, et al.. Achievements and advances at CMP. 3rd European Workshop on Microelectonics Education (EWME'2000), May 2000, Aix-en-Provence, France. ⟨hal-01381231⟩