Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3D Concept

Jean-Louis Marchesini (1) , Pierre-Olivier Jeannin (1) , Yvan Avenas (1) , Johan Delaine (1) , Cyril Buttay (2) , Raphaël Riva (3)

1 G2ELab - Laboratoire de Génie Electrique de Grenoble
2 EE - Ampère, Département Energie Electrique
3 IRT Saint Exupéry - Institut de Recherche Technologique

With the emergence of new power semiconductor devices, the switching speeds in power converters are increasing. The stray inductances of switching cells must therefore be minimized to limit over-voltages on transistors. One relatively new approach, called Power Chip-on-Chip (PCoC), considers the integration of power dies, one on top of the other, directly in the busbar. This allows for the reduction of the stray inductance. This paper first presents the implementation of a PCoC module using classical packaging techniques. Then a description of the different technological steps for the realization is outlined. Finally, experimental characterization results confirm the lower stray inductances offered by the PCoC package compared with the planar one.

Mots clés: Switches; Copper; Insulated gate bipolar transistors; Logic gates; Inductance; Substrates; Capacitors

Domaines: Sciences de l'ingénieur [physics]

Jean-Louis Marchesini, Pierre-Olivier Jeannin, Yvan Avenas, Johan Delaine, Cyril Buttay, et al.. Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3D Concept. IEEE Transactions on Industry Applications, 2016, PP (99), ⟨10.1109/TIA.2016.2604379⟩. ⟨hal-01373011⟩