Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface

Matthew Kwan (1) , Muriel Braccini (2, 1) , Ashutosh Jain (1) , Michael W. Lane (3) , Ganpati Ramanath (1)

1 RPI - Rensselaer Polytechnic Institute
2 SIMaP - Science et Ingénierie des Matériaux et Procédés
3 Department of Chemistry [Emory]

We reveal the roles of moisture and temperature on the interplay between interfacial work of adhesion gamma(a) and metal plasticity gamma(p) for copper-silica interfaces modified with an organosilane nanolayer. We find that gamma(p) not equal 0 for interfaces with metal thicknesses h(cu) > 12 nm, and increases with ha, before it saturates at h(cu) similar to 165 nm. For a fixed h(cu), gamma(p) increases due to temperature-induced yield stress decrease despite a decrease in gamma(a) with temperature because of water-induced siloxane bond weakening. These findings should be valuable for understanding the fracture mechanics of, and designing, nanomolecularly-functionalized interfaces subject to thermomechanical and chemical stresses. (C) 2016 Elsevier B.V. All rights reserved.

Domaines: Matériaux

Matthew Kwan, Muriel Braccini, Ashutosh Jain, Michael W. Lane, Ganpati Ramanath. Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface. Scripta Materialia, 2016, 121, pp.42-44. ⟨10.1016/j.scriptamat.2016.04.034⟩. ⟨hal-01371058⟩