Low-Damage etching of highly porous OSG low-k dielectrics

Jean-Francois de Marneffe (1) , Liping Zhang (1) , Mikhail Baklanov (1) , Koichi Yatsuda (2) , Kaoru Maekawa (2) , Cooke Mike (3) , Andy Goodyear (3) , Christian Dussarrat (4) , Remi Dussart (5) , Thomas Tillocher (5) , Floriane Leroy (5) , Philippe Lefaucheux (5) , Mitsuhiro Watanabe (1)

1 IMEC - IMEC
2 TEL - Tokyo Electron
3 Oxford Instruments
4 CTAS - Centre Technique des Applications du Soudage
5 GREMI - Groupe de recherches sur l'énergétique des milieux ionisés

Domaines: Physique des plasmas [physics.plasm-ph]

Jean-Francois de Marneffe, Liping Zhang, Mikhail Baklanov, Koichi Yatsuda, Kaoru Maekawa, et al.. Low-Damage etching of highly porous OSG low-k dielectrics. SPIE Advanced Lithography 2016, Feb 2016, San José, United States. ⟨hal-01280267⟩