3-Dimentional and High-Performance Air-Filled SIW Devices for Millimeter-Wave Substrate Integrated Circuits and Systems
Résumé
Emerging millimeter-wave frequency applications require high performance, low-cost and compact components and circuits. This is why Substrate Integrated Waveguide (SIW) technology, which combines advantages of planar circuits and non-planar metallic waveguides, has attracted much attention in recent years. However, not all three-dimensional metallic waveguide components and circuits are required to be made in planar form. In its first section, this paper reviews recently proposed three-dimensional SIW components that take advantages of the third-dimension to achieve either more compact or multi-dimensional circuits at millimeter-wave frequencies. Also in the second section, a special interest is oriented to the recent development of air-filled SIW techniques based on low-cost multilayer printed circuit board (PCB) for high-performance millimeter-wave substrate integrated circuits (SICs) and systems.