On-the-Field Test and Configuration Infrastructure for 2-D-Mesh NoCs in Shared-Memory Many-Core Architectures

Zhen Zhang 1 Dimitri Refauvelet 2 Alain Greiner 2 Mounir Benabdenbi 3 François Pecheux 2
1 Parkas - Parallélisme de Kahn Synchrone
DI-ENS - Département d'informatique de l'École normale supérieure, ENS Paris - École normale supérieure - Paris, Inria Paris-Rocquencourt, CNRS - Centre National de la Recherche Scientifique : UMR 8548
2 ALSOC - Architecture et Logiciels pour Systèmes Embarqués sur Puce
LIP6 - Laboratoire d'Informatique de Paris 6
Abstract : This paper addresses the important issue of fault tolerance in network-on-chip (NoC) and presents an on-the-field test and configuration infrastructure for a 2-D-mesh NoC, which can be used in many generic shared-memory many-core tiled architectures and MPSoCs. This paper also details all the hardware and software means needed to: 1) initialize the NoC in a clean state (self-deactivation of faulty NoC components using a controlled built-in self-test strategy) and 2) set up a distributed collaborative configuration infrastructure that can be used to make the chip autonomously determine, during its initialization, the operational degraded architecture, identify and bypass black holes. Experimental results prove that the approach is effective and lightweight in terms of additional software and hardware resources.
Type de document :
Article dans une revue
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2014, 22 (6), pp.1364 - 1376. 〈10.1109/TVLSI.2013.2271697〉
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https://hal.archives-ouvertes.fr/hal-01142562
Contributeur : Lucie Torella <>
Soumis le : mercredi 15 avril 2015 - 14:52:24
Dernière modification le : mardi 30 mai 2017 - 01:13:57

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Zhen Zhang, Dimitri Refauvelet, Alain Greiner, Mounir Benabdenbi, François Pecheux. On-the-Field Test and Configuration Infrastructure for 2-D-Mesh NoCs in Shared-Memory Many-Core Architectures. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2014, 22 (6), pp.1364 - 1376. 〈10.1109/TVLSI.2013.2271697〉. 〈hal-01142562〉

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