Advanced Wafer Level Packaging Technology by Layer Transfer Engineering : Application to 3D Packaging for vertical power devices

Nicolas Clément, Jean-Paul Rouger (1) , J. Widiez (2) , L. Benaissa (2) , B. Imbert (2) , P. Gondcharton (2) , B. Letowski (2) , T. Signamarcheix (2) , Jean-Christophe Crébier (1)

1 G2ELab - Laboratoire de Génie Electrique de Grenoble
2 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information

Domaines: Energie électrique

Nicolas Clément, Jean-Paul Rouger, J. Widiez, L. Benaissa, B. Imbert, P. Gondcharton, et al.. Advanced Wafer Level Packaging Technology by Layer Transfer Engineering : Application to 3D Packaging for vertical power devices. From nano to macro power electronics and packaging international workshop, Oct 2014, Tours, France. ⟨hal-01092423⟩