Focus on Links between High Frequency Substrate Noise and High Speed Signal Transmission in Interconnection Channels of 3D-IC - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2012

Focus on Links between High Frequency Substrate Noise and High Speed Signal Transmission in Interconnection Channels of 3D-IC

Fichier non déposé

Dates et versions

hal-01062178 , version 1 (09-09-2014)

Identifiants

  • HAL Id : hal-01062178 , version 1

Citer

M. Brocard, E. Eid, T. Lacrevaz, C. Bermond, G. Houzet, et al.. Focus on Links between High Frequency Substrate Noise and High Speed Signal Transmission in Interconnection Channels of 3D-IC. Micro-Nano-Electronics Packaging & Assembly, Design and Manufacturing,, Apr 2012, grenoble, France. ⟨hal-01062178⟩
176 Consultations
0 Téléchargements

Partager

Gmail Facebook X LinkedIn More