Studies on Die-to-Substrate Interconnects for High-Q PCB Inductors

Abstract : Wire-bond, solder ball, and copper pillar are generally utilised as chip-to-substrate interconnects. In this paper, the impact of these types of connections on achievable quality factor of a planar inductor is investigated. A simple and accurate Pimodel of such joints, and mathematical expressions to estimate the model elements are proposed. Results show a good agreement between the model and the EM-simulation results, with inductance accuracy within 10%. At a frequency of 2GHz, simulation results demonstrate that an inductance of 1:26nH with a Q-factor of 154 is achievable on an organic laminate substrate. However, the Q-factor is reduced to 100 when such inductor is connected to a silicon chip via a solder bump flip-chip process. In order to implement and to achieve the required Q-factor, a practical design remedy is introduced
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Conference papers
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https://hal.archives-ouvertes.fr/hal-00917035
Contributor : Equipe Conception de Circuits <>
Submitted on : Wednesday, December 11, 2013 - 10:58:39 AM
Last modification on : Thursday, January 11, 2018 - 6:21:06 AM

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  • HAL Id : hal-00917035, version 1

Citation

Francois Rivet, M. Pourakbar, L. Linton, M. Faulkner. Studies on Die-to-Substrate Interconnects for High-Q PCB Inductors. ICECS, Dec 2013, ABU DHABI, United Arab Emirates. pp.160-169. ⟨hal-00917035⟩

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