On the modeling of two direct bonded silicon surfaces

Abstract : Silicon direct bonding is used in the manufacturing of high performance optical system for terrestrial application such as Fabry-Perot interferometers, prism assemblies, etc. For example, this process has been used in the manufacture of the largest slicer ever used for the Multi Unit Spectroscopic Explorer [1]. Recently, this process is of particular interest to spatial instruments applications. Indeed, no mechanical part or glue are required, thanks to that, this is a high-precision production process and bonded assemblies present a dimensional stability. This kind of process has already passed with success the mechanical and thermal environment of space [2] where the constraints involved (thermal fatigue, vibrations, etc.) are very different from those encountered on Earth. However, it is necessary to quantify the bonding strength to improve the mechanical performance of adhesive bonds without degrading optical performances of the material used and to find optimum parameters of the process. Indeed, mechanical resistance of those bonded interfaces depends on interface defects, and especially the nature of bonds involved. Indeed, room temperature bonding needs flatness and roughness perfectly controlled, and no particles contaminations on surfaces [3]. Then, using mechanical test results, an unilateral contact law is developed in order to combine the mechanical properties of the bonded interface to the physical and chemical properties of bonded surfaces. The aim of this study is to model this particular type of adhesive contact in the framework of continuum mechanics. A finite element model with cohesive element and this unilateral contact law is used to simulate the wedge test [4]. References: [1] F. Laurent & Al, MUSE Image Slicer: Test results on largest slicer ever manufactured, 2009 [2] T. Pamploma & Al, Three bipods slicer prototype: tests and finite element calculations [3] A. Plobl, G. Krauter, Wafer direct bonding: tailoring adhesion between brittle materials, Material science and Engineering, R25, 1-88, 1999 [4] N. Cocheteau, F. Lebon, on the modelling of the direct bonding of two silicon surfaces, Proceedings of the Eleventh International Conference on Computational Structures Technology, Civil-comp press, 2012
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Submitted on : Saturday, June 22, 2013 - 2:32:34 PM
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  • HAL Id : hal-00837508, version 1


Natacha Cocheteau, Aurelien Maurel-Pantel, Frédéric Lebon, Iulian Rosu, Sonia Ait Zaid, et al.. On the modeling of two direct bonded silicon surfaces. 22 ème Congrès Général de la Société Française de Physique, Jul 2013, Marseille, France. ⟨hal-00837508⟩



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