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A vertical power device conductive assembly at wafer level using direct bonding technology

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Conference papers
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https://hal.archives-ouvertes.fr/hal-00820244
Contributor : Sylvie Garcia <>
Submitted on : Friday, May 3, 2013 - 2:50:50 PM
Last modification on : Wednesday, December 2, 2020 - 7:00:04 AM

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  • HAL Id : hal-00820244, version 1

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CEA | CNRS | G2ELAB | DRT | LETI | CEA-GRE | UGA

Citation

L. Benaissa, Nicolas Rouger, Julie Widiez, Jean-Christophe Crébier, J. Dafonseca, et al.. A vertical power device conductive assembly at wafer level using direct bonding technology. In Power Semiconductor Devices and ICs (ISPSD), Jun 2012, France. pp.77-80. ⟨hal-00820244⟩

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