A novel Power System in Package with 3D chip on chip interconnections of the power transistor and its gate driver
Résumé
Currently, most industrial power modules, even IPEMs (Intelligent Power Electronics Modules), are interconnected in a planar way, and interconnections are made with bonding wires. This paper presents a three dimensional interconnection solution based on the idea to flip chip the gate driver directly on the surface of the power device, simplifying and optimizing the packaging and the interconnections among the two devices and improving the overall performances. Various approaches and interconnection solutions will be presented in this paper, and the advantages of the chosen approach will be discussed. Then the technological process for the realization of the interconnections will be explained, and practical realizations will be shown.