Structural and thermal investigation for FBAR reliability in wireless applications

R.-Y. Fillit; B. Ivira; J. Boussey; R. Fortunier; P. Ancey

Conference Papers Year : 2005

Structural and thermal investigation for FBAR reliability in wireless applications

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R.-Y. Fillit

Function : Author

B. Ivira

Function : Author

J. Boussey

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Laboratoire des technologies de la microélectronique

R. Fortunier

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Institut de Microélectronique, Electromagnétisme et Photonique

P. Ancey

Function : Author

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Signal and Image processing Micro and nanotechnologies/Microelectronics Electromagnetism Signal and Image Processing

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https://hal.science/hal-00147190

Submitted on : Wednesday, May 16, 2007-10:23:49 AM

Last modification on : Thursday, April 4, 2024-9:20:46 PM

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hal-00147190 , version 1 (16-05-2007)

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HAL Id : hal-00147190 , version 1

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R.-Y. Fillit, B. Ivira, J. Boussey, R. Fortunier, P. Ancey. Structural and thermal investigation for FBAR reliability in wireless applications. International reliability physics symposium, IEEE IRPS, 2005, France. pp.XX. ⟨hal-00147190⟩

Structural and thermal investigation for FBAR reliability in wireless applications

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