3D self-assembling of SU-8 microstructures on silicon by plasma induced compressive stress

Jean-Baptiste Bureau (1) , Bernard Legrand (1) , Dominique Collard (2) , Lionel Buchaillot (1)

1 IEMN - Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520
2 CIRMM - Center for International Research on MicroMechatronics

This paper presents the development of suspended movable microstructures made of SU-8 photoresist where compressive stress leads to 3D self-assembled microstructures. Internal compressive stress in the photoresist is induced by an SF/sub 6/ based plasma process. Clamped-clamped beam structures have been fabricated to characterize the stress depending on the plasma duration and the lengths of the beams. A compressive stress of 48 MPa was calculated for a 3 minute plasma. X-ray photoelectron spectroscopy (XPS) analysis has been performed to characterize the surface of the structures. These mechanical properties could be used to make 3D self-assembled structures for applications in biological sciences

Mots clés: Microstructure; Silicon; Compressive stress; Plasma x-ray sources; Resists; Particle beams; Plasma applications; Plasma properties; Spectroscopy; Performance analysis

Domaines: Sciences de l'ingénieur [physics]

Jean-Baptiste Bureau, Bernard Legrand, Dominique Collard, Lionel Buchaillot. 3D self-assembling of SU-8 microstructures on silicon by plasma induced compressive stress. 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05., Jun 2005, Seoul, South Korea. pp.19-22, ⟨10.1109/SENSOR.2005.1496348⟩. ⟨hal-00128655⟩