Fault modeling of suspended thermal MEMS

B. Charlot (1) , Salvador Mir (1) , E.F. Cota (1) , Marcelo Lubaszewski (1) , B. Courtois (1)

1 TIMA - Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés

As next generation chips embedding MEMSappear, fault-based and defect-oriented tests forMEMS parts become important for cost-effectiveproduction testing. This paper presents realisticfault modeling and simulation techniques forsuspended thermal MEMS, an already successfuldomain of application.

Mots clés: suspended-thermal-MEMS; fault-modeling; next-generation-chips-embedding-MEMS; cost-effective-production-testing; simulation-techniques; defect-oriented-tests; fault-based-tests; fault-injection; CMOS-compatible-bulk-micromachining; micromachining-defects; thermal-short; analog-HDL; electrothermal-convertor; FEM-modelling; equivalent-electrical-model; fault-simulation

Domaines: Micro et nanotechnologies/Microélectronique

B. Charlot, Salvador Mir, E.F. Cota, Marcelo Lubaszewski, B. Courtois. Fault modeling of suspended thermal MEMS. 1999, pp.319-28, ⟨10.1109/TEST.1999.805646⟩. ⟨hal-00007871⟩