Additive manufacturing of copper/diamond composites for thermal management applications

Loïc Constantin (1, 2, 3) , Lisha Fan (1, 2) , Mael Pontoreau (3) , Fei Wang (4) , Bai Cui (4) , Jean-Luc Battaglia (5) , Jean-François Silvain (3) , Yong Feng Lu (1, 2)

1 University of Nebraska–Lincoln
2 Department of Electrical and Computer Engineering
3 ICMCB - Institut de Chimie de la Matière Condensée de Bordeaux
4 Department of Mechanical and Materials Engineering
5 I2M - Institut de Mécanique et d'Ingénierie

Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.

Mots clés: Additive manufacturing; composites; copper; diamond; interphase

Domaines: Matériaux

Loïc Constantin, Lisha Fan, Mael Pontoreau, Fei Wang, Bai Cui, et al.. Additive manufacturing of copper/diamond composites for thermal management applications. Manufacturing Letters, 2020, 24, pp.61-66. ⟨10.1016/j.mfglet.2020.03.014⟩. ⟨hal-02565504⟩