Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality
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Communication Dans Un Congrès
Année : 1998
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https://hal.science/hal-01550279
Soumis le : jeudi 29 juin 2017-14:35:47
Dernière modification le : lundi 5 juin 2023-16:52:11
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- HAL Id : hal-01550279 , version 1
Citer
S. Dilhaire, A. Cornet, E. Schaub, C. Rauzan, W. Claeys. Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality. 9th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 98), 1998, Unknown, Unknown Region. pp.1293-1296. ⟨hal-01550279⟩
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