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Article Dans Une Revue Microelectronics Reliability Année : 1998

Thermoreflectance measurements of transient temperature upon integrated circuits: application to thermal conductivity identification

Résumé

An analytical 2D study, based on the method of integral transform, for transient heat transfer in a multilayered structure, and an optical technique for transient temperature measurement have been developed. Their application to the case of Joule heating of micrometric interconnections on submicron insulation layers permits one to identify thermophysical properties of the materials involved.

Dates et versions

hal-01550255 , version 1 (29-06-2017)

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T. Phan, S. Dilhaire, V. Quintard, W. Claeys, J. C. Batsale. Thermoreflectance measurements of transient temperature upon integrated circuits: application to thermal conductivity identification. Microelectronics Reliability, 1998, 29 (4-5), pp.181-190. ⟨10.1016/s0026-2692(97)00056-6⟩. ⟨hal-01550255⟩

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