Structural and thermal properties of hot pressed Cu/C matrix composites materials used for the thermal management of high power electronic devices
Résumé
In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials.