Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

Bassem Mouawad (1) , Maher Soueidan (1, 2) , D. Fabregue (3) , Cyril Buttay (1) , Vincent Bley (4) , Bruno Allard (1)

1 AMPERE - Ampère
2 lebanese Atomic Energy Commission
3 MATEIS - Matériaux, ingénierie et science [Villeurbanne]
4 LAPLACE-MDCE - Matériaux Diélectriques dans la Conversion d’Energie

In this study, bonding of high purity polished copper was investigated using the Spark Plasma Sintering technique (SPS) showing the effect of SPS parameters on the bonding strength and on the microstructural behaviour.

Domains: Electric power

Bassem Mouawad, Maher Soueidan, D. Fabregue, Cyril Buttay, Vincent Bley, et al.. Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process. CIMA, Mar 2011, Beyrouth, Lebanon. pp.CD. ⟨hal-00687147v2⟩