A cell theory for stage IV work hardening of metals and semiconductors
Résumé
Work hardening of fcc metals and diamond structure crystals is considered in a cell model. Depending on stacking fault energy and temperature dynamic recovery can occur by cross slip or climb. The remaining dislocations cause a rehardening stage IV of two different origins and in two temperature ranges before the other dynamic recovery mechanism terminates work hardening.
Domaines
Articles anciensOrigine | Accord explicite pour ce dépôt |
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