Editorial: 3DIM-DS 2015: Optical image processing in the context of 3D imaging, metrology, and data security
Résumé
ollowing the first International Symposium on 3D Imaging, Metrology, and Data Security (3DIM-DS) held in Shenzhen during september 2015, this special issue gathers a series of articles dealing with the main topics discussed during this symposium. These topics highlighted the importance of studying complex data treatment systems and intensive calculations designed for high dimensional imaging and metrology for which high image quality and high transmission speed become critical issues in a number of technological applications. A second purpose was to celebrate the International Year of Light by emphasizing the important role of optics in actual information processing systems.