Power electronic package having two substrates with multiple semiconductor chips and electronic components

Cyril Buttay (1) , C Mark Johnson (1) , Rahesh Kumar Malhan (2) , Jeremy Rashid (3) , Florin Udrea (3)

1 University of Sheffield [Sheffield]
2 DENSO (JAPAN)
3 CAM - University of Cambridge [UK]

Domaines: Energie électrique

Cyril Buttay, C Mark Johnson, Rahesh Kumar Malhan, Jeremy Rashid, Florin Udrea. Power electronic package having two substrates with multiple semiconductor chips and electronic components. United States, Patent n° : US8432030B2. 2013. ⟨hal-03193203⟩