Coupling PCM-based Heat Sinks finite elements model for mechatronic devices with Design Optimization procedure

Bessem Debich (1, 2) , Ahmed Yaich (1, 3) , Abdelkhalak Elhami (1) , Wajih Gafsi (2) , Lassaad Walha (2) , Mohamed Haddar (2)

1 LMN - Laboratoire de Mécanique de Normandie
2 LA2MP - Laboratoire de recherche de Mécanique, Modélisation et Production
3 ITheMM - Institut de Thermique, Mécanique, Matériaux

Domaines: Mécanique [physics.med-ph]

Bessem Debich, Ahmed Yaich, Abdelkhalak Elhami, Wajih Gafsi, Lassaad Walha, et al.. Coupling PCM-based Heat Sinks finite elements model for mechatronic devices with Design Optimization procedure. 2020 IEEE 6th International Conference on Optimization and Applications (ICOA), Apr 2020, Beni Mellal, France. pp.1-4, ⟨10.1109/ICOA49421.2020.9094460⟩. ⟨hal-03112276⟩