Study of packaging reliability of two SiC Schottky diodes of power electronic

Guillaume Parent (1) , Vincent Huleux (1) , Gregor Massiot (1) , Vincent Rouet (1) , Catherine Munier (1) , Paul-Etienne Vidal (2) , Francisco Javier Carrillo (2)

1 AIRBUS Group Innovations
2 LGP - Laboratoire Génie de Production

This study deals with reliability methods developed for power electronic devices dedicated to the aerospace industry, because the reliability is a key issue for safe aerospace applications. Based on end-user requirements, eight different types of non-hermetic power electronic components in standard plastic package have been selected from the commercial marketplace, in particular Si and SiC power electronic devices. These devices are COTS (Component Off The Shelf). The main failure modes and mechanisms expected have been highlighted in specific environments in accordance with the literature. They will be presented in the final paper.

Mots clés: Packaging reliability; SiC Schottky diodes

Domaines: Electronique

Guillaume Parent, Vincent Huleux, Gregor Massiot, Vincent Rouet, Catherine Munier, et al.. Study of packaging reliability of two SiC Schottky diodes of power electronic. From Nano to Macro Power Electronics and Packaging, 2015, Tours, Oct 2015, Tours, France. pp.1. ⟨hal-03033243⟩