Edge Water Penetration in Direct Bonding Interface

F. Rieutord (1) , S. Tardif (1) , D. Landru (2) , O. Kononchuk (2) , V. Larrey (3) , H. Moriceau (3) , M. Tedjini (3) , F. Fournel (3)

1 NRS - Nanostructures et Rayonnement Synchrotron
2 SOITEC SA
3 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information

We report here on measurements demonstrating that water is able to enter a hydrophilic wafer bonding assembly from the edge. The driving forces for water entry are capillary forces driven by the negative Laplace pressure. The characteristic time for water to penetrate the interface is consistent with standard values for water viscosity and gap width.

Domaines: Science des matériaux [cond-mat.mtrl-sci]; Micro et nanotechnologies/Microélectronique

F. Rieutord, S. Tardif, D. Landru, O. Kononchuk, V. Larrey, et al.. Edge Water Penetration in Direct Bonding Interface. PRiME 2016/230th ECS Meeting, Electrochemical Society, Oct 2016, Honolulu, United States. pp.163-167, ⟨10.1149/07509.0163ecst⟩. ⟨hal-02016077⟩