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Numerical modeling and prediction of thermomechanical degradation of power electronic packaging

Abstract : This work aims at numerical thermomechanical studies of two types of high temperature silver connections elaborated at low temperatures, the transient liquid phase bonding (TLPB) of Ag-In and silver nanoparticles sintering, using test vehicles representing the final packaging assemblies of diamond components. The simulation is performed using a finite element code on 2D and 3D assemblies. The stress distribution in the assemblies and in the two die-attachments was studied during thermal cycling in the range temperature between -50 and 300°C. A comparison of these two technology trends with respect to their applicability for power electronics packaging was conducted.
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Submitted on : Monday, February 10, 2014 - 5:07:51 PM
Last modification on : Monday, March 21, 2016 - 5:28:47 PM
Long-term archiving on: : Sunday, May 11, 2014 - 7:00:42 AM

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  • HAL Id : hal-00944556, version 1
  • OATAO : 10599

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Ahlem Baazaoui, Olivier Dalverny, Joël Alexis, Moussa Karama. Numerical modeling and prediction of thermomechanical degradation of power electronic packaging. ICSAAM 2013, The 5th International Conference on Structural Analysis of Advanced Materials, Sep 2013, Island of Kos, Greece. ⟨hal-00944556⟩

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